◆DESCRIPTION
 
●NTC thermistor is Negative Temperature Coefficient of Thermal resistor.
●A thermistor is a thermally sensitive resistor whose primary function is to exhibit a change in electrical resistance with a change in body temperature.
●NTC thermistor is one in which the zero-power resistance decreases with an increase in temperature.
 
 
◆FEATURES

●Small Size, Low Capacitance at 40 MHz (below 3pF)
●Corresponding to the high B value.
●Glass coated perform for long term reliability
●Strong against electrostatic.
●Excellent in cost-performance.
●High Accuracy and High Environmental Resistance are provided due to our original
Manufacturing Method.
●All Pb-free product  [ Pb and Cd are not contained in product ]


 
◆APPLICATIONS
 
●Mobile Communication related equipment.（TCXO, RF circuit, LCD panel, Battery pack）.
●Computer related equipment.
●Temperature detection for CPU and memory device.
●Video camcorder, car audio related equipment.
●Temperature compensation for contrast of LCD.
●Optical communication equipm.


◆BASIC CHARACTERISTICS




1. Zero-power Resistance of Thermistor         

R= R0 exp B (1/T-1/T0) ..............(1)
R : Resistance in ambient temperature T (K)
(K : absolute temperature)
R0 : Resistance in ambient temperature T0 (K)
B : B-constant of Thermistor
 
2. B-Constant

As (1) formula
B= ㏑ (R/R₀) / (1/T-1/T0) -------- (2)
 
3. Thermal Dissipation Constant

When spend electric power P (mW) in
ambient temperature T1, if Thermistor
temperature rises T2, there is a formula as  
follows
P= C (T2 -T1)  ---------- (3)
C : Thermal dissipation constant (mW/℃)
Thermal dissipation constant change by
dimensions, measure, measured condition etc.

4. Thermal Time Constant

Period in which Thermistor temperature will
change 63.2% of its temperature difference
from ambient temperature T0 (℃) to T1 (℃).
 



◆RELIABILITY TEST

Test Item		Standard	Test Method	△R25 / R25
Environmental test	Life	MIL-STD-202F Method 108A	Test temperature：70℃ Test duration：1000 hrs Load power：1206 – 6.5 mW，0805 – 5.0 mW，0603 – 4.5 mW，0402 – 3.5 mW。	MAX.± 3﹪
	Humidity	MIL-STD-202F Method 103B	Test temperature：40℃ Test humidity：95﹪ Test duration：1000 hrs Load power：1206 – 6.5 mW，0805 – 5.0 mW，0603 – 4.5 mW， 0402 – 3.5 mW。	MAX.± 3﹪
	Thermal shock	MIL-STD-202F Method 107G	Test cycle：10 times Test temperature：- 40℃＆125℃	MAX.± 3﹪
	Storage in dry heat	IEC 68-2-2	Test temperature：125℃ Test duration：1000 hrs
Mechanical Performance test	Solderability	MIL-STD-202F Method 208 H	Soldering temperature：235℃ Duration of immersion：2 seconds	95 ﹪min. coverage
	Resistance to soldering heat	MIL-R-55342D PARA 4.7.7	Soldering temperature：260℃ Duration of immersion：10 seconds	MAX.± 3﹪

Mechanical Performance test	Bending strength	JIS C 5202 6.1.4	Pressurizing rod at a rate of 1mm/sec Maintenance time：5 sec Bending distance：1 mm (min.)	Visual :           No mechanical damage
	Resistance to flexure of substrate	JIS C 5202 6.2.1	Pressurizing force shall be 3kg	MIN. 3 Kg
Electrical Performance test	Insulation resistance	MIL-STD-202F Method 302	DC 250V For 10 seconds	Over 1000MΩ
	Dielectric withstand voltage	MIL-STD-202F Method 301	DC 250V For 10 seconds	NOT Short

◆CHIP DIMENSION



 

Size	L[mm]	W[mm]	T[mm]	C[mm]
1005 (0402)	1.00 ± 0.05	0.50 ± 0.05	0.50 ± 0.05	0.25 ± 0.10
1608 (0603)	1.60 ± 0.10	0.80 ± 0.10	0.80 ± 0.10	0.40 ± 0.20
2012 (0805)	2.00 ± 0.20	1.25 ± 0.20	0.80 ± 0.20	0.50 ± 0.20
3216 (1206)	3.40 ± 0.20	1.70 ± 0.20	1.40 ± 0.20	0.50 ± 0.20

◆CHIP STRUCTURE



◆SMD CHIP NTC ORDER MAP
 

Series Code	Chip Size (mm)	Res. value	Res. Tolerance	B Value	B Tolerance
SMD NTC	02(0402) – 1.0x0.5x0.6	101 = 10 x 101 = 100 Ω	F :  ±  1%	3435	F :  ±  1%
F : Lead Free	03(0603) – 1.6x0.8x0.8	102 = 10 x 102 = 1000 Ω	G :  ± 2%		G :  ± 2%
	05(0805) – 2.0x1.2x1.2	103 = 10 x 103 = 10000 Ω	H : ±  3%		H : ±  3%
	06(1206) – 3.2x1.6x1.4		J  :  ±  5%
			K :  ±  10%

 
 
 
◆SPECIFICATION
 
I.1005（0402）Size

Part Number	Resistance（25℃）（Ω）	B-constant （25-85℃）             （k）	Maximum Power Rating（25℃）     （mW）	Thermal Dissipation Constant        （mW/℃）	Operating Temp. Range （℃）
UT□02300□2600□	30	2600	250	2.5	-40 ~ 125
UT□02300□3250□	30	3250
UT□02330□3250□	33	3250
UT□02470□3250□	47	3250
UT□02680□3250□	68	3250
UT□02101□3250□	100	3250
UT□02221□3250□	220	3250
UT□02102□4100□	1.0 K	4100
UT□02152□4100□	1.5 K	4100
UT□02202□4100□	2.0 K	4100
UT□02202□4520□	2.0 K	4520
UT□02222□4100□	2.2 K	4100
UT□02302□4100□	3 K	4100
UT□02472□3520□	4.7 K	3520
UT□02103□3435□	10K	3435
UT□02103□3800□	10K	3800
UT□02103□3950□	10K	3950
UT□02103□4050□	10K	4050
UT□02103□4100□	10K	4100
UT□02103□4550□	10K	4550
UT□02153□3920□	15K	3920
UT□02223□3800□	22K	3800
UT□02223□4550□	22K	4550
UT□02333□4050□	33K	4050
UT□02473□3920□	47K	3920
UT□02473□4050□	47K	4050
UT□02473□4550□	47K	4550
UT□02683□4150□	68K	4150
UT□02104□4050□	100K	4050
UT□02104□4600□	100K	4600
UT□02154□4050□	150K	4050
UT□02224□4600□	220K	4600
UT□02474□4050□	470K	4050
UT□02474□4650□	470K	4650

 
 

 

II.1608（0603）Size

Part Number	Resistance（25℃）（Ω）	B-constant （25-85℃）             （k）	Maximum Power Rating（25℃）     （mW）	Thermal Dissipation Constant        （mW/℃）	Operating Temp. Range （℃）
UT□03220□3050□	22	3050	350	3.5	-40 ~ 125
UT□03300□3200□	30	3200
UT□03330□3200□	33	3200
UT□03400□3200□	40	3200
UT□03470□3200□	47	3200
UT□03680□3200□	68	3200
UT□03101□2800□	100	2800
UT□03101□3250□	100	3250
UT□03221□3250□	220	3250
UT□03102□4150□	1 K	4150
UT□03152□4150□	1.5 K	4150
UT□03202□4150□	2 K	4150
UT□03202□4150□	2.2 K	4150
UT□03302□4150□	3 K	4150
UT□03472□4150□	4.7 K	4150
UT□03472□4500□	4.7 K	4500
UT□03502□3250□	5 K	3250
UT□03502□3970□	5 K	3970
UT□03682□4150□	6.8 K	4150
UT□03103□3400□	10K	3400
UT□03103□3435□	10K	3435
UT□03103□3550□	10K	3550
UT□03103□3800□	10K	3800
UT□03103□3970□	10K	3970
UT□03303□3950□	30K	3950
UT□03473□3950□	47K	3950
UT□03473□4050□	47K	4050
UT□03503□4100□	50K	4100
UT□03683□4150□	68K	4150
UT□03104□3970□	100K	3970
UT□03104□4050□	100K	4050
UT□03104□4400□	100K	4400
UT□03154□3800□	150K	3800
UT□03154□4600□	150K	4600
UT□03224□4600□	220K	4600
UT□03234□4600□	230K	4100
UT□03334□4050□	330K	4050
UT□03474□4050□	470K	4050
UT□03684□4100□	680K	4750

 
 
III.2012（0805）Size

Part Number	Resistance（25℃）（Ω）	B-constant （25-85℃）             （k）	Maximum Power Rating（25℃）     （mW）	Thermal Dissipation Constant        （mW/℃）	Operating Temp. Range （℃）
UT□05102□3600□	1 K	3600	400	4	-40 ~ 125
UT□05202□4100□	2 K	4100
UT□05222□4100□	2.2 K	4100
UT□05682□3750□	6.8 K	3750
UT□05472□4100□	4.7 K	4100
UT□05103□3435□	10K	3435
UT□05103□3550□	10K	3550
UT□05103□3750□	10K	3960
UT□05103□3970□	10K	3970
UT□05153□4050□	15K	4000
UT□05333□3950□	33K	3950
UT□05473□3950□	47K	3950
UT□05473□4050□	47K	4050
UT□05503□4100□	50K	4100
UT□05683□3800□	68K	3800
UT□05104□3977□	100K	3977
UT□05104□4050□	100K	4050
UT□05224□4100□	220K	4100
UT□05234□4100□	230K	4100
UT□05334□4100□	330K	4100
UT□05474□4100□	470K	4100
UT□05684□4100□	680K	4100

 
 

 

◆REFLOW SOLDERING PROFILE

Temp. [deg. C]

 

Zone		Temp. range [deg. C]	time [sec]	Remark
a	Curing	RT ~	60 90 ~ 150 90 ~ 150 min 60	* Solder : Sn-Ag-Cu * 260deg. C, over 10
b	Preheat	max
c	Soldering	220 ~ 260 [max 270]
d	Cooling	220 ~

◆MOUNTING POSITION

Choose a mounting position that minimize the stress imposed on the chip during flexing or bending of the board.


◆TAPE DIMENSION
 


 

Size	A0	B0	W	D1	E	F	P	P0	P2	t
1005	0.65±0.10	1.15±0.10	8.00±0.20	1.50±0.25	1.75±0.10	3.50±0.50	4.0±0.10	4.0±0.10	2.0±0.10	0.23±0.10
1608	1.10±0.10	1.90±0.10
2012	1.50±0.10	2.35±0.10
3216	1.80±0.10	3.50±0.10

 
 
 
◆REEL DIMESIONS

Chip size	ΦA	ΦB	ΦC	G	t
≤ 2012	178±2.0	13.0±0.5	22.0±2.0	10.0±1.5	2.5±0.5

 




◆PACKING SPECIFICATION

 

Dimension	1005 (0402)	1608 (0603)	2012 (0805)	3216 (1206)	Carrier Tape
pcs/reel	10,000	4,000	4,000	3,000	Paper