UTF- SMD Series
Details
 
DESCRIPTION
 
●NTC thermistor is Negative Temperature Coefficient of Thermal resistor.
●A thermistor is a thermally sensitive resistor whose primary function is to exhibit a change in electrical resistance with a change in body temperature.
●NTC thermistor is one in which the zero-power resistance decreases with an increase in temperature.
 
 
FEATURES

●Small Size, Low Capacitance at 40 MHz (below 3pF)
●Corresponding to the high B value.
●Glass coated perform for long term reliability
●Strong against electrostatic.
●Excellent in cost-performance.
●High Accuracy and High Environmental Resistance are provided due to our original
Manufacturing Method.
●All Pb-free product  [ Pb and Cd are not contained in product ]


 
APPLICATIONS
 
●Mobile Communication related equipment.(TCXO, RF circuit, LCD panel, Battery pack).
●Computer related equipment.
●Temperature detection for CPU and memory device.
●Video camcorder, car audio related equipment.
●Temperature compensation for contrast of LCD.
●Optical communication equipm.


BASIC CHARACTERISTICS




1. Zero-power Resistance of Thermistor         

R= R0 exp B (1/T-1/T0) ..............(1)

R : Resistance in ambient temperature T (K)
(K : absolute temperature)
R0 : Resistance in ambient temperature T0 (K)
B : B-constant of Thermistor
 
2. B-Constant

As (1) formula
B= ㏑ (R/R0) / (1/T-1/T0) -------- (2)
 
3. Thermal Dissipation Constant

When spend electric power P (mW) in
ambient temperature T1, if Thermistor
temperature rises T2, there is a formula as  
follows
P= C (T2 -T1)  ---------- (3)
C : Thermal dissipation constant (mW/℃)
Thermal dissipation constant change by
dimensions, measure, measured condition etc.

4. Thermal Time Constant

Period in which Thermistor temperature will
change 63.2% of its temperature difference
from ambient temperature T0 (℃) to T1 (℃).
 



RELIABILITY TEST
 
Test Item Standard Test Method R25 / R25
Environmental
test
Life MIL-STD-202F
Method 108A
Test temperature:70℃
Test duration:1000 hrs
Load power:1206 – 6.5 mW,0805 – 5.0 mW,0603 – 4.5 mW,0402 – 3.5 mW。
MAX.± 3﹪
Humidity MIL-STD-202F
Method 103B
Test temperature:40℃
Test humidity:95﹪
Test duration:1000 hrs
Load power:1206 – 6.5 mW,0805 – 5.0 mW,0603 – 4.5 mW, 0402 – 3.5 mW。
MAX.± 3﹪
Thermal shock MIL-STD-202F
Method 107G
Test cycle:10 times
Test temperature:- 40℃&125℃
MAX.± 3﹪
Storage in dry heat IEC 68-2-2 Test temperature:125℃
Test duration:1000 hrs
 
Mechanical
Performance
test
Solderability MIL-STD-202F
Method 208 H
Soldering temperature:235℃
Duration of immersion:2 seconds
95 ﹪min.
coverage
Resistance to soldering heat MIL-R-55342D
PARA 4.7.7
Soldering temperature:260℃
Duration of immersion:10 seconds
MAX.± 3﹪
 
Mechanical
Performance
test
Bending strength JIS C 5202 6.1.4 Pressurizing rod at a rate of 1mm/sec
Maintenance time:5 sec
Bending distance:1 mm (min.)
Visual :           No mechanical damage
Resistance to flexure of substrate JIS C 5202 6.2.1 Pressurizing force shall be 3kg
MIN. 3 Kg
Electrical
Performance
test
Insulation resistance MIL-STD-202F
Method 302
DC 250V For 10 seconds
Over 1000MΩ
Dielectric withstand voltage MIL-STD-202F
Method 301
DC 250V For 10 seconds NOT Short


CHIP DIMENSION



 
Size L[mm] W[mm] T[mm] C[mm]
1005 (0402) 1.00 ± 0.05 0.50 ± 0.05 0.50 ± 0.05 0.25 ± 0.10
1608 (0603) 1.60 ± 0.10 0.80 ± 0.10 0.80 ± 0.10 0.40 ± 0.20
2012 (0805) 2.00 ± 0.20 1.25 ± 0.20 0.80 ± 0.20 0.50 ± 0.20
3216 (1206) 3.40 ± 0.20 1.70 ± 0.20 1.40 ± 0.20 0.50 ± 0.20


CHIP STRUCTURE



SMD CHIP NTC ORDER MAP
 
Series Code Chip Size (mm) Res. value Res. Tolerance B Value B Tolerance
SMD NTC 02(0402) – 1.0x0.5x0.6 101 =
10 x 101 = 100 Ω
F :  ±  1% 3435 F :  ±  1%
F : Lead Free 03(0603) – 1.6x0.8x0.8 102 =
10 x 102 = 1000 Ω
G :  ± 2%   G :  ± 2%
  05(0805) – 2.0x1.2x1.2 103 = 10 x 103
= 10000 Ω
H : ±  3%   H : ±  3%
  06(1206) – 3.2x1.6x1.4   J  :  ±  5%    
      K :  ±  10%    
 
 
 
SPECIFICATION
 

I.1005(0402)Size
Part Number Resistance25)(Ω B-constant
25-85             k
Maximum Power Rating25     mW Thermal Dissipation Constant        mW/ Operating Temp. Range
UT□02300□2600□ 30 2600 250 2.5 -40 ~ 125
UT□02300□3250□ 30 3250
UT□02330□3250□ 33 3250
UT□02470□3250□ 47 3250
UT□02680□3250□ 68 3250
UT□02101□3250□ 100 3250
UT□02221□3250□ 220 3250
UT□02102□4100□ 1.0 K 4100
UT□02152□4100□ 1.5 K 4100
UT□02202□4100□ 2.0 K 4100
UT□02202□4520□ 2.0 K 4520
UT□02222□4100□ 2.2 K 4100
UT□02302□4100□ 3 K 4100
UT□02472□3520□ 4.7 K 3520
UT□02103□3435□ 10K 3435
UT□02103□3800□ 10K 3800
UT□02103□3950□ 10K 3950
UT□02103□4050□ 10K 4050
UT□02103□4100□ 10K 4100
UT□02103□4550□ 10K 4550
UT□02153□3920□ 15K 3920
UT□02223□3800□ 22K 3800
UT□02223□4550□ 22K 4550
UT□02333□4050□ 33K 4050
UT□02473□3920□ 47K 3920
UT□02473□4050□ 47K 4050
UT□02473□4550□ 47K 4550
UT□02683□4150□ 68K 4150
UT□02104□4050□ 100K 4050
UT□02104□4600□ 100K 4600
UT□02154□4050□ 150K 4050
UT□02224□4600□ 220K 4600
UT□02474□4050□ 470K 4050
UT□02474□4650□ 470K 4650
 
 

 

II.1608(0603)Size
Part Number Resistance25)(Ω B-constant
25-85             k
Maximum Power Rating25     mW Thermal Dissipation Constant        mW/ Operating Temp. Range
UT□03220□3050□ 22 3050 350 3.5 -40 ~ 125
UT□03300□3200□ 30 3200
UT□03330□3200□ 33 3200
UT□03400□3200□ 40 3200
UT□03470□3200□ 47 3200
UT□03680□3200□ 68 3200
UT□03101□2800□ 100 2800
UT□03101□3250□ 100 3250
UT□03221□3250□ 220 3250
UT□03102□4150□ 1 K 4150
UT□03152□4150□ 1.5 K 4150
UT□03202□4150□ 2 K 4150
UT□03202□4150□ 2.2 K 4150
UT□03302□4150□ 3 K 4150
UT□03472□4150□ 4.7 K 4150
UT□03472□4500□ 4.7 K 4500
UT□03502□3250□ 5 K 3250
UT□03502□3970□ 5 K 3970
UT□03682□4150□ 6.8 K 4150
UT□03103□3400□ 10K 3400
UT□03103□3435□ 10K 3435
UT□03103□3550□ 10K 3550
UT□03103□3800□ 10K 3800
UT□03103□3970□ 10K 3970
UT□03303□3950□ 30K 3950
UT□03473□3950□ 47K 3950
UT□03473□4050□ 47K 4050
UT□03503□4100□ 50K 4100
UT□03683□4150□ 68K 4150
UT□03104□3970□ 100K 3970
UT□03104□4050□ 100K 4050
UT□03104□4400□ 100K 4400
UT□03154□3800□ 150K 3800
UT□03154□4600□ 150K 4600
UT□03224□4600□ 220K 4600
UT□03234□4600□ 230K 4100
UT□03334□4050□ 330K 4050
UT□03474□4050□ 470K 4050
UT□03684□4100□ 680K 4750



 
 
III.2012(0805)Size
Part Number Resistance25)(Ω B-constant
25-85             k
Maximum Power Rating25     mW Thermal Dissipation Constant        mW/ Operating Temp. Range
UT□05102□3600□ 1 K 3600 400 4 -40 ~ 125
UT□05202□4100□ 2 K 4100
UT□05222□4100□ 2.2 K 4100
UT□05682□3750□ 6.8 K 3750
UT□05472□4100□ 4.7 K 4100
UT□05103□3435□ 10K 3435
UT□05103□3550□ 10K 3550
UT□05103□3750□ 10K 3960
UT□05103□3970□ 10K 3970
UT□05153□4050□ 15K 4000
UT□05333□3950□ 33K 3950
UT□05473□3950□ 47K 3950
UT□05473□4050□ 47K 4050
UT□05503□4100□ 50K 4100
UT□05683□3800□ 68K 3800
UT□05104□3977□ 100K 3977
UT□05104□4050□ 100K 4050
UT□05224□4100□ 220K 4100
UT□05234□4100□ 230K 4100
UT□05334□4100□ 330K 4100
UT□05474□4100□ 470K 4100
UT□05684□4100□ 680K 4100
 
 

 

REFLOW SOLDERING PROFILE

Temp. [deg. C]


 
Zone Temp. range [deg. C] time [sec] Remark
a Curing RT ~ 60
90 ~ 150
90 ~ 150
min 60
 
* Solder : Sn-Ag-Cu
* 260deg. C, over 10
b Preheat max
c Soldering 220 ~ 260 [max 270]
d Cooling 220 ~





MOUNTING POSITION

Choose a mounting position that minimize the stress imposed on the chip during flexing or bending of the board.


TAPE DIMENSION
 


 
Size A0 B0 W D1 E F P P0 P2 t
1005 0.65±0.10 1.15±0.10 8.00±0.20 1.50±0.25 1.75±0.10 3.50±0.50 4.0±0.10 4.0±0.10 2.0±0.10 0.23±0.10
1608 1.10±0.10 1.90±0.10                
2012 1.50±0.10 2.35±0.10                
3216 1.80±0.10 3.50±0.10                
 
 
 
REEL DIMESIONS


Chip size ΦA ΦB ΦC G t
≤ 2012 178±2.0 13.0±0.5 22.0±2.0 10.0±1.5 2.5±0.5
 




PACKING SPECIFICATION

 
Dimension 1005 (0402) 1608 (0603) 2012 (0805) 3216 (1206) Carrier Tape
pcs/reel 10,000 4,000 4,000 3,000 Paper